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Zkoušky s chladivem R 134a = Tests of R 134a refrigerantPESEK, M.Průmysl potravin. 1993, Vol 44, Num 2, pp 74-76, issn 0033-1988Article

The viscosity of nitrous oxide and tetrafluoromethane in the limit of zero densityMILLAT, J; VESOVIC, V; WAKEHAM, W. A et al.International journal of thermophysics. 1991, Vol 12, Num 2, pp 265-273, issn 0195-928XArticle

SPECTROSCOPY OF THE CF4 LASERMCDOWELL RS; PATTERSON CW; JONES CR et al.1979; OPT. LETTERS; USA; DA. 1979; VOL. 4; NO 9; PP. 274-276; BIBL. 10 REF.Article

ANISOTROPIC PLASMA ETCHING OF SEMICONDUCTOR MATERIALSPARRY PD; RODDE AF.1979; SOLID STATE TECHNOL.; USA; DA. 1979; VOL. 22; NO 4; PP. 125-132; BIBL. 37 REF.Article

CF4 ETCHING IN A DIODE SYSTEMBONDUR JA.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 2; PP. 226-231; BIBL. 17 REF.Article

PLASMA ETCHING OF FILMS AT HIGH RATES.HEINECKE RAH.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 21; NO 4; PP. 104-106; BIBL. 7 REF.Article

UNTERSUCHUNG DER SCHWINGUNGSRELAXATION VON METHAN UND TETRAFLUORMETHAN BEIM STOSS MIT WASSERSTOFF, DEUTERIUM UND EDELGASEN. = ETUDE DE LA RELAXATION VIBRATIONNELLE DU METHANE ET DU TETRAFLUORO-METHANE LORS DE COLLISIONS AVEC L'HYDROGENE, LE DEUTERIUM ET LES GAZ RARESKLEIN R; HESS P.1975; ACUSTICA; ALLEM.; DA. 1975; VOL. 33; NO 3; PP. 198-202; ABS. ANGL. FR.; BIBL. 9 REF.Article

Surface characterization of nickel alloy plasma-treated by O2/CF4 mixtureCHAN-PARK, Mary B; JIANXIA GAO; KOO, Arthur H. L et al.Journal of adhesion science and technology. 2003, Vol 17, Num 15, pp 1979-2004, issn 0169-4243, 26 p.Article

Possible greenhouse effects of tetrafluoromethane and carbon dioxide emitted from aluminium productionWESTON, R. E.Atmospheric environment (1994). 1996, Vol 30, Num 16, pp 2901-2910, issn 1352-2310Article

CF4 and the age of mesospheric and polar vortex airHARNISCH, J; BORCHERS, R; FABIAN, P et al.Geophysical research letters. 1999, Vol 26, Num 3, pp 295-298, issn 0094-8276Article

Effects of additives on the selectivity of byproducts and dry removal of fluorine for abating tetrafluoromethane in a discharge reactorTSAI, Cheng-Hsien; KUO, Zhao-Zhi.Journal of hazardous materials (Print). 2009, Vol 161, Num 2-3, pp 1478-1483, issn 0304-3894, 6 p.Article

Reactive high power impulse magnetron sputtering of CFx thin films in mixed Ar/CF4 and Ar/C4F8 dischargesSCHMIDT, S; GOYENOLA, C; GUEORGUIEV, G. K et al.Thin solid films. 2013, Vol 542, pp 21-30, issn 0040-6090, 10 p.Article

VISCOSITY OF MULTICOMPONENT MIXTURES OF FOUR COMPLEX GASES.KESTIN J; KHALIFA HE; WAKEHAM WA et al.1976; J. CHEM. PHYS.; U.S.A.; DA. 1976; VOL. 65; NO 12; PP. 5186-5188; BIBL. 18 REF.Article

LOADING EFFECT AND TEMPERATURE DEPENDENCE OF ETCH RATE OF SILICON MATERIALS IN CF4 PLASMAENOMOTO T.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 4; PP. 117-121; BIBL. 8 REF.Article

EXPERIMENTAL EVALUATION OF CRYOGENIC HEAT PIPES WITH VARIOUS HEAT CARRIERS AND CAPILLARY STRUCTURESKREEB H; MOLT W.1978; INTERNATIONAL HEAT PIPE CONFERENCE. 3/1978/PALO ALTO CA; USA; DA. 1978; PP. 203-210; BIBL. 7 REF.Conference Paper

PLASMA ETCHING - A "PSEUDO-BLACK-BOX" APPROACH.WINTERS HF; COBURN JW; KAY E et al.1977; J. APPL. PHYS.; U.S.A.; DA. 1977; VOL. 48; NO 12; PP. 4973-4983; BIBL. 26 REF.Article

PLASMA REACTOR DESIGN FOR THE SELECTIVE ETCHING OF SIO2 ON SI.HEINECKE RAH.1976; SOLID-STATE ELECTRON.; G.B.; DA. 1976; VOL. 19; NO 12; PP. 1039-1040; BIBL. 11 REF.Article

Solubility of CF4 in lower alcoholsSOUSA, J. M. M. V; FERREIRA, A. G. M; FACHADA, H. C et al.Fluid phase equilibria. 2010, Vol 296, Num 2, pp 95-98, issn 0378-3812, 4 p.Conference Paper

CF4 LASER OSCILLATOR-AMPLIFIER MEASUREMENTS: SMALL SIGNAL GAIN AND SELF-ABSORPTIONECKHARDT RC; HINSLEY R; PILCH M et al.1979; OPT. LETTERS; USA; DA. 1979; VOL. 4; NO 4; PP. 112-114; BIBL. 5 REF.Article

CF4 PLASMA ETCHING ON LINBO3LEE CL; LU CL.1979; APPL. PHYS. LETT.; ISSN 0003-6951; USA; DA. 1979; VOL. 35; NO 10; PP. 756-758; BIBL. 9 REF.Article

EFFET D'UN PLASMA BASSE TEMPERATURE, UTILISE EN TECHNOLOGIE DE MICROELECTRONIQUE, SUR LES COUCHES D'ENDUITS PHOTORESISTANTSLUBY SH; GULDAN A; CHERVENAK YA et al.1979; POLUPROVODN. MIKROELEKTRON.; UKR; DA. 1979; NO 30; PP. 55-64; BIBL. 12 REF.Article

DIFFUSION OF GASEOUS FLUOROMETHANES IN AIR.RAW CJG; RAW TT.1976; CHEM. PHYS. LETTERS; NETHERL.; DA. 1976; VOL. 44; NO 2; PP. 255-256; BIBL. 6 REF.Article

MAGNETIC FIELD CONTROL OF REACTIVE PLASMA ETCHINGMINKIEWICZ VJ; CHEN M; COBURN JW et al.1979; APPL. PHYS. LETT.; ISSN 0003-6951; USA; DA. 1979; VOL. 35; NO 5; PP. 393-394; BIBL. 2 REF.Article

COLLISION INDUCED MICROWAVE ABSORPTION IN N2, CH4 AND CF4 IN THE GASEOUS AND LIQUID PHASES.URBANIAK JL; DAGG IR; REESOR GE et al.1977; CANAD. J. PHYS.; CANADA; DA. 1977; VOL. 55; NO 6; PP. 496-505; ABS. FR.; BIBL. 19 REF.Article

ION-SURFACE INTERACTIONS IN PLASMA ETCHING.COBURN JW; WINTERS HF; CHUANG TJ et al.1977; J. APPL. PHYS.; U.S.A.; DA. 1977; VOL. 48; NO 8; PP. 3532-3540; BIBL. 23 REF.Article

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